12.2.5 Grain boundary chemical diffusion

This chapter provides data for grain boundary chemical diffusion of Ag-Au, Ag-Cd, Al-Cr, Al-Cu, Al-O, Al-Zn, Au-Pd, Cu-Ag, Cu-Be, Cu-In, Cu-Mg, Cu-Ni, Cu-Sb, Cu-Zn, Fe-Ni, Fe-Zn, Fe-Zn, Na-Cl, Ni-In, W-Mo, Zr-C, Zr-Ca and Zr-Hf alloy systems. Arrhenius parameters and volume interdiffusion data used for the evaluation of grain boundary chemical diffusion are tabulated for the alloy system. The method of determination includes electrical contact resistance (ECR), Auger electron spectroscopy (AES), Electrochemical (EC), electrical sheet resistance measurements (ESR), grain boundary precipitates (GBP), Electron probe microanalysis (EPMA), discontinuous precipitation kinetics (DP), discontinuous coarsening kinetics (DC), Rutherford backscattering spectroscopy (RBS), X-ray diffraction (XRD) and diffusion-induced grain boundary migration (DIGM).